Electronic device

ABSTRACT

An electronic device is disclosed and includes a base substrate, a circuit layer, and a plurality of light-emitting elements. The base substrate has a plurality of through holes, the circuit layer is disposed on the base substrate, and the light-emitting elements are disposed on the first circuit layer. An absolute value of a difference between two adjacent spacings of the plurality of through holes of the base substrate is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 17/161,617, filed on Jan. 28, 2021, which is a division of U.S.application Ser. No. 16/362,676, filed on Mar. 24, 2019, which claimsthe benefit of U.S. Provisional Application No. 62/660,222, filed onApr. 19, 2018. The contents of these applications are incorporatedherein by reference.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to an electronic device, and moreparticularly to a flexible electronic device.

2. Description of the Prior Art

With the advance of display technology, large-sized display apparatusare used in more and more places, such that more consumers can watch thesame image at the same time. Since the size of the large-sized displayapparatus is beyond the size of the display device that can be generallyproduced, in order to achieve large-sized display, the display apparatusis formed by jointing a plurality of display devices. Because thedisplay apparatus is formed by the plural display devices, themanufacturing cost is relatively high, such that if one of the displaydevices is damaged, other undamaged display devices still need to betaken apart for repairing. Therefore, to repair the large-sized tilingdisplay apparatus is not convenient.

SUMMARY OF THE DISCLOSURE

An embodiment of the present disclosure provides an electronic deviceincluding a base substrate, a circuit layer, and a plurality oflight-emitting elements. The base substrate has a plurality of throughholes, the circuit layer is disposed on the base substrate, and thelight-emitting elements are disposed on the first circuit layer. Anabsolute value of a difference between two adjacent spacings of theplurality of through holes of the base substrate is less than 0.5 timesradius of curvature of the electronic device when the electronic deviceis bent.

These and other objectives of the present disclosure will no doubtbecome obvious to those of ordinary skill in the art after reading thefollowing detailed description of the embodiment that is illustrated inthe various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a sectional view of an electronic device according toa first embodiment of the present disclosure.

FIG. 2 illustrates a sectional view of an electronic device according toa variant embodiment of the first embodiment of the present disclosure.

FIG. 3 illustrates a sectional view of an electronic device according toanother variant embodiment of the first embodiment of the presentdisclosure.

FIG. 4 and FIG. 5 respectively illustrate a sectional view and a topview of a tiling electronic apparatus according to a second embodimentof the present disclosure.

FIG. 6 illustrates a sectional view of a tiling electronic apparatusaccording to a variant embodiment of a second embodiment of the presentdisclosure.

FIG. 7 illustrates a sectional view of a tiling electronic apparatusaccording to another variant embodiment of a second embodiment of thepresent disclosure.

FIG. 8 illustrates a sectional view of a tiling electronic apparatusaccording to another variant embodiment of a second embodiment of thepresent disclosure.

FIG. 9 illustrates a sectional view of a tiling electronic apparatusaccording to another variant embodiment of a second embodiment of thepresent disclosure.

DETAILED DESCRIPTION

The present disclosure may be understood by reference to the followingdetailed description, taken in conjunction with the drawings asdescribed below. For purposes of illustrative clarity and being easilyunderstood by the readers, various drawings of this disclosure show aportion of the display device, and certain elements in various drawingsmay not be drawn to scale. In addition, the number and dimension of eachdevice shown in drawings are illustrative and are not intended to limitthe scope of the present disclosure.

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willunderstand, electronic equipment manufacturers may refer to a componentby different names. This document does not intend to distinguish betweencomponents that differ in name but not function. In the followingdescription and in the claims, the terms “include” and “comprise” areused in an open-ended fashion, and thus should be interpreted to mean“include, but not limited to . . . ”. It will be understood that when acomponent is referred to as being “coupled to” another component (or itsvariant), it can be directly connected to the another component, or beindirectly connected (for example electrically connected) to the anothercomponent through one or more intervening component. However, the use oflike and/or corresponding numerals in the drawings of differentembodiments does not suggest any correlation between differentembodiments. In addition, in this specification, expressions such as“first material layer disposed above/on/over a second material layer”,may indicate the direct contact of the first material layer and thesecond material layer, or it may indicate a non-contact state with oneor more intermediate layers between the first material layer and thesecond material layer. In the above situation, the first material layermay not be in direct contact with the second material layer.

It should be noted that the technical features in different embodimentsdescribed in the following can be replaced, recombined, or mixed withone another to constitute another embodiment without departing from thespirit of the present disclosure.

Refer to FIG. 1 which illustrates a sectional view of an electronicdevice according to a first embodiment of the present disclosure. Theelectronic device 10A comprises a base substrate 12, a first circuitlayer 14 and a plurality of light-emitting elements 16. The basesubstrate 12 has a first surface S1 and a second surface S2 opposite toeach other. The first circuit layer 14 is disposed on the first surfaceS1 and extends from the first surface S1 to the second surface S2through an edge of the base substrate 12. The light-emitting elements 16are disposed on a part of the first circuit layer 14 on the firstsurface S1. The first circuit layer 14 comprises abase layer (not shownin figures) and a circuit (not shown in figures) disposed on the baselayer. In some embodiments, the base layer may comprise a polymer layer.For example, a material of the base substrate 12 and a material of thebase layer may comprise polyimide (PI), polyethylene terephthalate(PET), polycarbonate (PC), poly(ethylene succinate) (PES), polybutyleneterephthalate (PBT), polyethylene naphthalate (PEN), polyarylate (PAR),other suitable material, or a combination thereof, but the presentdisclosure is not limited thereto. Furthermore, in some embodiments, thelight-emitting elements 16 comprises one of light-emitting diodes(LEDs), micro LEDs, mini LEDs, other display mediums, or a combinationthereof, but the present disclosure is not limited thereto. Thelight-emitting elements 16 may for instance be LED packages or LEDchips. Also, the light-emitting elements 16 may be single-sided (topsurface) lighting type, four-sided (four side surfaces) lighting type orfive-sided (top surface and four side surfaces) lighting type.

In one embodiment, the electronic device 10A may be a display device.Each light-emitting element 16 may serve as a display unit, such as apixel or a sub-pixel, but the present disclosure is not limited thereto.In some embodiments, the electronic device 10A may be a sensing deviceor an antenna for example. In this embodiment, the first circuit layer14 may comprise a first portion 14 a, a second portion 14 b and a thirdportion 14 c. The first portion 14 a may be a part of the first circuitlayer 14 disposed on the first surface S1, the second portion 14 b maybe a part of the first circuit layer 14 disposed on the second surfaceS2, and the third portion 14 c is a part of the first circuit layer 14connecting the first portion 14 a and the second portion 14 b.Furthermore, the light-emitting elements 16 are disposed on the firstportion 14 a. In this embodiment, the electronic device 10A may furthercomprise a driving unit 18 for driving the light-emitting elements 16.The driving unit 18 is disposed on the part of the first circuit layer14 bent onto the second surface S2 of the base substrate 12 (the secondportion 14 b), and the light-emitting elements 16 disposed on the firstportion 14 a of the first circuit layer 14 may be electrically connectedto the driving unit 18 disposed on the second portion 14 b of the firstcircuit layer 14. For example, the driving unit 18 may comprise a gatedriving unit and a source driving unit. By means of bending andextending the first circuit layer 14 onto the second surface S2 of thebase substrate 12, a part of the first circuit layer 14 with the drivingunit 18 disposed thereon (for example the second portion 14 b) may bedisposed under the base substrate 12, such that a region of theelectronic device 10A without displaying image may be reduced, and a gapbetween two adjacent electronic devices 10A may be also shrunk. In oneembodiment, a spacing between two adjacent light-emitting elements 16respectively in two adjacent electronic devices 10A may be close to oridentical to a gap between two adjacent light-emitting elements 16 inthe same one electronic device 10A, and thus, the gap between theadjacent electronic devices 10A is not easily seen by user. In someembodiments, the circuit of the first circuit layer 14 may comprise anarray circuit. For example, the array circuit may comprise a pluralityof scan lines, a plurality of data lines, a plurality of power lines, aplurality of drive transistors and a plurality of switch transistors,and one of the light-emitting elements 16 may be controlled by thecorresponding scan line, the corresponding data line, the correspondingpower line, the corresponding drive transistor and the correspondingswitch transistor. The first circuit layer 14 may be formed by forexample a thin-film transistor process. In some embodiments, theelectronic device 10A may optionally further comprise a shielding layerSL disposed on the exposed first circuit layer 14 for shielding thecircuit of the first circuit layer 14. In one embodiment, the shieldinglayer SL may be disposed on a part of the first portion 14 a of thefirst circuit layer 14 where the light-emitting elements 16 are notdisposed on. The shielding layer SL may be disposed on the exposedsecond portion 14 b. A material of the shielding layer SL may comprisean insulating material, such as an organic material.

In this embodiment, the electronic device 10A may optionally comprise asecond circuit layer 20 disposed on the second surface S2 of the basesubstrate 12 and electrically connected to the first circuit layer 14.Specifically, the second circuit layer 20 may be electrically connectedto the driving unit 18 and the first circuit layer 14 through aconductive adhesive or a connector. The connector may for example aslot. By means of the second circuit layer 20, different electronicdevices 10A may be electrically connected to each other, such that theplural electronic devices 10A may display a full image. In oneembodiment, a composition of the second circuit layer 20 may bedifferent from that of the first circuit layer 14. At least one of thesecond circuit layer 20, the second surface S2 of the base substrate 12and a surface of the first circuit layer 14 facing the light-emittingelements 16 comprises at least one microstructure. The microstructuremay be for example a recess, a bump or a through hole, and a sectionalshape of the recess or the bump taken along a direction (such as ahorizontal direction H) may be arc, triangle, rectangular, polygonal orother suitable shapes. In some embodiments, the microstructure may alsocomprise the recess with bump disposed therein (not shown in figures).By means of disposition of the microstructure, the electronic device 10Amay have better flexibility when the electronic device 10A is bent andmay not be damaged due to bending.

In this embodiment, the second circuit layer 20 may comprise at leastone first microstructure MS1. Besides the recess or bump, the firstmicrostructure MS1 may be for example a bent structure of the secondcircuit layer 20 protruding toward a direction away from the secondsurface S2, such that the first microstructure MS1 may not be in contactwith the base substrate 12. For this reason, when the electronic device10A is bent, the first microstructure MS1 may provide a stretchablespace for the second circuit layer 20. In this embodiment, the number ofthe first microstructure MS1 may be plural, and the plural firstmicrostructures MS1 are dispersed on the second surface S2 without thefirst circuit layer 14 disposed thereon. A spacing G1 may exist betweencenter points of two adjacent first microstructures MS1. In thisembodiment, the spacings G1 of the plural first microstructures MS1 maybe close to or equal to each other, but not limited thereto. When thespacings G1 are close to each other, an absolute value of a differencebetween two spacings G1 may be less than 0.5 times radius of curvatureof the electronic device 10A when the electronic device 10A is bent. Inother embodiments, the spacings G1 of the first microstructures MS1 maybe determined based on the positions of the electronic device 10A thatthe first microstructures MS1 correspond to. For example, a bendingrange of the electronic device 10A in a peripheral region adjacent tothe edge may be greater than that of the electronic device 10A in acentral region far away from the edge, so the spacing G1 of the firstmicrostructures MS1 in the peripheral region of the electronic device10A may be less than the spacing G1 of the microstructures MS1 in thecentral region of the electronic device 10A.

The second surface S2 of the base substrate 12 may optionally compriseat least one second microstructure MS2, the surface of the first circuitlayer 14 facing the light-emitting elements 16 may optionally compriseat least one third microstructure MS3, and the first microstructure MS1may correspond to at least one of the second microstructure MS2 and thethird microstructure MS3. In this embodiment, one of the firstmicrostructures MS1 may overlap at least one of the secondmicrostructure MS2 and the third microstructure MS3 in a top-viewdirection V, for example a center point of the first microstructure MS1may be close to a center point of the second microstructure MS2 in thetop-view direction V. As an example, the second surface S2 of the basesubstrate 12 may comprise a plurality of second microstructures MS2, andthe first portion 14 a of the first circuit layer 14 may comprise aplurality of third microstructures MS3. A spacing G2 exists between thecenter points of two adjacent second microstructures MS2. The spacing G1may be 0.9 to 1.1 times the spacing G2. An absolute value of adifference between two spacings G2 may be less than 0.5 times radius ofcurvature of the electronic device 10A when the electronic device 10A isbent, such that the radius of curvature of the bent electronic device10A may be uniform. Another spacing G3 exists between center points oftwo adjacent third microstructures MS3. In this embodiment, the spacingG2 may be different from the spacing G3. Accordingly, when one of thesecond microstructures MS3 overlaps the corresponding firstmicrostructure MS1, a part of one of the third microstructures MS3 mayoverlap the corresponding first microstructure MS1, and another part ofthe third microstructure MS3 does not overlap the corresponding firstmicrostructure MS1. In some embodiments, the spacing G3 may be identicalto the spacing G2.

In some embodiments, the second microstructures MS2 may comprise aplurality of first sub-microstructures MS21 and a plurality of secondsub-microstructures MS22, and a spacing G21 between two adjacent firstsub-microstructures MS21 may be different from a spacing G22 between twoadjacent second sub-microstructures MS22. For example, the firstsub-microstructures MS21 may be disposed in the central region of theelectronic device 10A far away from the edge, the secondsub-microstructures MS22 may be disposed in the peripheral region of theelectronic device 10A adjacent to the edge, and the spacing G21 isgreater than the spacing G22. Furthermore, a size of each firstsub-microstructure MS21 may also be different from a size of each secondsub-microstructure MS22. For example, a width of each firstsub-microstructure MS21 in the horizontal direction H may be greaterthan a width of each second sub-microstructure MS22 in the horizontaldirection H. The width of the microstructure may be the largest width ofthe microstructure in the horizontal direction H for instance. When themicrostructure has an irregular shape, the width of the microstructuremay be the largest length in the horizontal direction H formed by twopoints in the opening of the microstructure. Alternatively, a surfacearea of each first sub-microstructure MS21 may be greater than a surfacearea of each second sub-microstructure MS22. In some embodiments, thefirst microstructures MS1 and the third microstructures MS3 may alsocomprise the first sub-microstructures and the secondsub-microstructures respectively, and the relative relations between thefirst sub-microstructures and the second sub-microstructures of thefirst sub-microstructures and the second sub-microstructures may besimilar to that between the first sub-microstructures MS21 and thesecond sub-microstructures MS22 of the second microstructures MS2.

In this embodiment, the electronic device 10A may have a bending centeraxis CA disposed in the first circuit layer 14. For example, when theelectronic device 10A is bent, compression or tension is not easilygenerated at the electronic device 10A of the bending center axis CA.Specifically, a distance between the bending center axis CA and a topsurface of each light-emitting element 16 may be substantially equal toa distance between the bending center axis CA and a surface of thesecond circuit layer 20 far away from the base substrate 12, but notlimited thereto. The farther away from the bending center axis CA thespacing is, the less the spacing may be. In other words, when a part ofthe electronic device 10A is farther away from the bending center axisCA, stress to the part of the electronic device 10A is greater when theelectronic device 10A is bent. Accordingly, by means of reduction of thesize of the spacing, the stress that the electronic device 10A receivesmay be reduced. For example, when a distance between the firstmicrostructures MS1 and the bending center axis CA may be greater than adistance between the third microstructures MS3 and the bending centeraxis CA, the spacing G1 of the first microstructures MS1 may be lessthan the spacing G3 of the third microstructures MS3. In thisembodiment, the spacing G1 of the first microstructures MS1 may be equalto the spacing G21 of the first sub-microstructure MS21, but not limitedthereto. In some embodiments, the spacing G1 of the firstmicrostructures MS1 may be less than the spacing G21 of the firstsub-microstructures MS21.

Additionally, the size of the microstructure may be greater when themicrostructure is farther away from the bending center axis CA. Forexample, since the distance between the first microstructures MS1 andthe bending center axis CA is greater than the distance between thesecond microstructures MS2 and the bending center axis CA and thedistance between the third microstructures MS3 and the bending centeraxis CA, the width of each first microstructure MS1 in the horizontaldirection H parallel to the first surface S1 may be greater than thewidth of each second microstructure MS2 in the horizontal direction Hand the width of each third microstructure MS3 in the horizontaldirection H. In some embodiments, the distance between the secondmicrostructures MS2 and the bending center axis CA may be greater thanthe distance between the third microstructures MS3 and the bendingcenter axis CA, so the width of each second microstructure MS2 in thehorizontal direction H may be greater than the width of each thirdmicrostructure MS3 in the horizontal direction H. Alternatively, in someembodiments, the surface area of each first microstructure MS1 may begreater than the surface area of each second microstructure MS2 andgreater than the surface area of each third microstructure MS3. In someembodiments, the electronic device 10A may have the firstmicrostructures MS1, the second microstructures MS2, the thirdmicrostructures MS3, or any two of them.

The electronic device is not limited by the aforementioned embodimentand may have other different variant embodiments or embodiments. Tosimplify the description, the identical components in each of thefollowing variant embodiments or embodiments are marked with identicalsymbols. For making it easier to compare the difference between thefirst embodiment and the variant embodiment and the difference betweenthe first embodiment and other embodiments, the following descriptionwill detail the dissimilarities among different variant embodiments orembodiments and the identical features will not be redundantlydescribed.

Refer to FIG. 2 which illustrates a sectional view of an electronicdevice according to a variant embodiment of the first embodiment of thepresent disclosure. The electronic device 10B provided in this variantembodiment is different from the previous embodiment in that at leastone of the first microstructures MS1 b does not overlap the secondmicrostructures MS2 b in the top-view direction V. That is, the firstmicrostructure MS1 b and the second microstructures MS2 b are staggeredin the top-view direction V. For example, the first microstructures MS1b does not overlap the first sub-microstructure MS21 b in the top-viewdirection V. In other embodiments, at least one of the firstmicrostructures MS1 b may overlap the corresponding secondmicrostructure MS2 b, and other first microstructures MS1 b may notoverlap the second microstructures MS2 b. In some embodiments, at leastone of the first microstructures MS1 b may also not overlap the thirdmicrostructures MS3 in the top-view direction V. Alternatively, at leastone of the first microstructures MS1 b may overlap a part of the thirdmicrostructures MS3 in the top-view direction V, and other firstmicrostructures MS1 b may not overlap the third microstructures MS3.Similarly, the second microstructures MS2 b and the thirdmicrostructures MS3 may have similar relative relation between them. Inthe present disclosure, the term “overlap” described herein refers to atleast partial overlap between two components.

Refer to FIG. 3 which illustrates a sectional view of an electronicdevice according to another variant embodiment of the first embodimentof the present disclosure. The electronic device 10C provided in thisvariant embodiment is different from the previous embodiment in that thebase substrate 12C of this variant embodiment comprises a plurality ofpillar or strip structures 22 that are different from the hemisphericalstructures shown in FIG. 2 . In other embodiments, the base substrate12C may also comprise at least one of a block-shaped structure and amesh-shaped structure. For example, the base substrate 12C comprises theplurality of pillar structures 22 separated from each other, such thatthe flexibility of the base substrate 12C may be increased. Forachieving supporting effect, the first surfaces S1 of the pillarstructures 22 may be in contact with the first circuit layer 14, and thesecond surface S2 of the pillar structures 22 may be in contact with thesecond circuit layer 20. In this embodiment, each second microstructureMS2 c may be a through hole penetrating through the base substrate 12C,and the through hole is disposed between two adjacent pillar structures22. Furthermore, the second microstructures MS2 c may be connected toeach other and to from a mesh-shaped structure, a groove-shapedstructure, other suitable structure or a combination thereof. In otherembodiments, a sectional shape of each pillar structure 22 in thehorizontal direction H may be for example rectangular, trapezoid,triangle, elliptical, semicircular, polygonal or other suitable shape.The area of the surfaces of the pillar structures 22 facing thelight-emitting elements 16 may be greater than or less than the area ofthe surfaces of the pillar structures 22 facing the second circuit layer20. For example, the disposition of triangular pillar structure 22 maybe upright or inverted. In some embodiments, the pillar structure,block-shaped structure or strip structure may comprise solid structureor three-dimensional mesh-shaped structure. The three-dimensionalmesh-shaped structure may have a plurality of pores. For example, thethree-dimensional mesh-shaped structure comprises sponge. The pores maybe filled with for example air or compressible material.

The electronic device of the above-mentioned embodiment may be appliedto the tiling electronic apparatus, such as a rollable display screenthat replaces the projection screen. Refer to FIG. 4 and FIG. 5 whichrespectively illustrate a sectional view and a top view of a tilingelectronic apparatus according to a second embodiment of the presentdisclosure. The tiling electronic apparatus 100A provided by thisembodiment comprises a plurality of electronic devices 102A and a firstsubstrate 104, in which the electronic devices 102A may be combined intoan assembly to display an image with large size. In one embodiment, theelectronic devices 102A may not have the microstructures, but thepresent disclosure is not limited thereto. In some embodiments, theelectronic devices 102A may adapt the electronic device of any oneembodiment mentioned above.

In this embodiment, the first substrate 104 comprises a plurality ofprotrusion parts 106 arranged along a first horizontal direction H1, andone of the protrusion parts 106 may be engaged between two adjacentlight-emitting elements 16 of each electronic device 102A. In someembodiments, the electronic devices 102A may be fixed on the firstsubstrate 104 through the engagement between the protrusion parts 106and the light-emitting elements. The electronic devices 102A may also befixed to the first substrate 104 through other components. The firstsubstrate 104 may comprise a plurality of first recesses R1, in whichthe first recesses R1 are formed between the protrusion parts 106, andone of the light-emitting elements 16 of each electronic device 102A maybe disposed in the corresponding first recess R1. Specifically, thefirst substrate 104 may comprise an engaging layer 108, and a surface ofthe engaging layer 108 facing the electronic devices 102A has theprotrusion parts 106. A width of each protrusion part 106 in the firsthorizontal direction H1 may be slightly greater than or equal to a gapbetween two adjacent the light-emitting elements 16. A width of eachfirst recess R1 in the first horizontal direction H1 may be slightlyless than or equal to a width of each light-emitting element 16 in thefirst horizontal direction H1, such that sidewalls of each protrusionpart 106 may be engaged between the sidewalls of two adjacentlight-emitting elements 16 through compression. In some embodiments, amaterial of the engaging layer 108 may comprise compressible material,such as silicone, polyurethane (PU), or other suitable material.Alternatively, the engaging layer 108 may comprise a hard material, andthe hard material may have a plurality of pores spaced apart from thegaps between the protrusion parts 106; that is to say, the hard materialmay have three-dimensional mesh shape. For example, a material of theengaging layer 108 may comprise sponge. The pores may be filled with forexample air or compressible material. By means of the compressibility ofthe protrusion parts 106, not only the protrusion parts 106 can beengaged between light-emitting elements 16, but also the light-emittingelements 16 can be prevented from damage during the engaging process. Insome embodiments, the first substrate 104 may further comprise a baselayer 110 serving as a base substrate for supporting the protrusionparts 104. A material of the base layer 110 may comprise polyethyleneterephthalate (PET), but not limited thereto. It is noted that since theelectronic devices 102A are independently engaged with the protrusionparts 106, single one of the electronic devices 102A may be taken apartfrom the protrusion parts 106 alone, thereby facilitating repair orexchange for the single one electronic device 102A. In one embodiment,the protrusion parts 106 may be disposed at intervals. In anotherembodiment, a plurality of light-emitting elements 16 may be disposed inone recess R.

In this embodiment, the first circuit layer 14 of each electronic device102A may be bent onto the second surface S2 of the base substrate 12,such that the second portion 14 b of the first circuit layer 14 may befixed on the second surface S2 of the base substrate 12. In otherembodiments, the second portion 14 b of the first circuit layer 14 ofeach electronic device 102A may be extend to be under another electronicdevice 102A adjacent thereto and be adhered to the second surface S2 ofthe base substrate 12 adjacent thereto. In such situation, a boundarybetween the first portion 14 a and the second portion 14 b of the firstcircuit layer 14 may have alignment opening for facilitating assemblingof two adjacent electronic devices 102A.

In this embodiment, the tiling electronic apparatus 100A may optionallycomprise a second substrate 112A with a second recess R2, and a part ofthe second portion 14 b of each first circuit layer 14 is engaged withthe second recess R2. Refer to FIG. 5 as well, specifically, the secondrecess R2 may be mesh-shaped and comprise a plurality of firstsub-recesses R21 extending along the first horizontal direction H1 and aplurality of second sub-recesses R22 extending along the secondhorizontal direction H2, in which the first sub-recess R21 and thesecond sub-recesses cross each other to form the mesh shape. Forexample, the first horizontal direction H1 may be substantiallyperpendicular to the second horizontal direction H2. An angle includedbetween the first horizontal direction H1 and the second horizontaldirection H2 may range from 60 degrees to 120 degrees. The secondportion 14 b of each first circuit layer 14 may be disposed in thecorresponding second sub-recess R22. A width of the second portion 14 bof each first circuit layer 14 in the first horizontal direction H1 maybe slightly greater than or equal to a width of the corresponding secondsub-recess R22 in the first horizontal direction H1, such that thesecond portion 14 b can be engaged with the second sub-recess R22. Insome embodiments, one of the second recesses R2 may be engaged with thecorresponding driving unit 18; that is, the width of the secondsub-recess R22 in the first horizontal direction H1 may be slightly lessthan or equal to a width of the corresponding driving unit 18 in thefirst horizontal direction H1. In some embodiments, a material of thesecond substrate 112A may comprise compressible material, such assilicone, PU, or other suitable material. Alternatively, a material ofthe second substrate 112A may comprise a hard material. The material ofthe second substrate 112A may have a plurality of pores and may havethree-dimensional mesh shape. For example, the second substrate 112A maycomprise sponge. The pores may be filled with for example air orcompressible material.

Additionally, in this embodiment, each second circuit layer 20 may bedisposed in the corresponding first sub-recess R21 or the correspondingsecond sub-recess R22 and may electrically connect the adjacentelectronic devices 102A to each other. For example, one of the secondcircuit layers 20 may be electrically connected to one of the firstcircuit layers 14 through a connector CN. The connector CN may be forexample a connecting pad or slot disposed on the first circuit layer 14.The second circuit layers 20 may extend along the first horizontaldirection H1 or the second horizontal direction H2 and electricallyconnect the electronic devices 102A arranged along the first horizontaldirection H1 or the electronic devices 102A arranged along the secondhorizontal direction H2. In some embodiments, the second circuit layers20 may be integrated into the second substrate 112A; that is, the secondsubstrate 112A may comprise connecting circuit for connecting theelectronic devices 102A, thereby saving the second circuit layers 20.

Refer to FIG. 6 which illustrates a sectional view of a tilingelectronic apparatus according to a variant embodiment of a secondembodiment of the present disclosure. The tiling electronic apparatus100B provided by this variant embodiment is different from the previousembodiment in that the second surface S2B of the base substrate 12B ineach electronic device 102B has a first uneven portion 114B facing thesecond substrate 112B, the second substrate 112B has a plurality ofsecond uneven portions 116B facing the base substrate 12B, and the firstuneven portions 114B may be engaged with the respective second unevenportion 116B in this embodiment. For example, each first uneven portion114B comprises a plurality of recesses R3B, each second uneven portion116B comprises a plurality of protrusion parts PB, and the protrusionparts PB may be engaged with the respective recess R3B. In someembodiments, each first uneven portion 114B may also comprise theprotrusion parts, and each second uneven portion 116B comprises therecesses, such that the protrusion parts are engaged with the respectiverecess. In some embodiments, the electronic device 102B may also adaptthe electronic device of any one above-mentioned embodiment.

Refer to FIG. 7 which illustrates a sectional view of a tilingelectronic apparatus according to another variant embodiment of a secondembodiment of the present disclosure. The tiling electronic apparatus100C provided by this variant embodiment is different from the previousembodiment in that a bottom of one of the first recesses R1C of thisvariant embodiment is spaced apart from a top surface of thecorresponding light-emitting element 16, such that a cavity is formedbetween the first recess R1C and the corresponding light-emittingelement 16. For example, the cavity C may adjust a spatial distributionof an output light from the light-emitting element 16 and may serve as alens. In other embodiments, the spatial distribution of the output lightmay be adjusted by filling the cavity C with optical material oraltering a shape of the cavity C. In some embodiments, the bottom of thefirst recess R1C may be for example a concave arc shape, a convex arcshape, a planar shape, or a combination thereof.

Refer to FIG. 8 which illustrates a sectional view of a tilingelectronic apparatus according to another variant embodiment of a secondembodiment of the present disclosure. The tiling electronic apparatus100D provided by this variant embodiment is different from the previousembodiment in that one of electronic devices 102D further comprises anengaging member 24 disposed on the second surface S2 of the basesubstrate 12, and the engaging member 24 may have a first uneven portion114D facing the second substrate 112D. The second substrate 112D mayhave a plurality of second uneven portions 116D facing the engagingmember 24. The first uneven portion 114D may be engaged with thecorresponding second uneven portion 116D. For example, the first unevenportion 114D comprise a plurality of protrusion parts PD, each seconduneven portion 116D comprises a plurality of recesses R3D, and eachprotrusion part PD may be engaged with the respective recess R3D. Theprotrusion parts PD of the engaging member 24 may have compressibility.In some embodiments, the first uneven portion 114D may also comprise therecesses, and each second uneven portion 116D comprises the protrusionparts, such that the protrusion parts are engaged with the respectiverecess. In some embodiment, the electronic device 102D may also adaptthe electronic device of any one above-mentioned embodiment.

Refer to FIG. 9 which illustrates a sectional view of a tilingelectronic apparatus according to another variant embodiment of a secondembodiment of the present disclosure. The tiling electronic apparatus100E provided by this variant embodiment is different from the previousembodiment in that the electronic devices 102E of this variantembodiment may be fixed on the substrate 120 through an adhesive layer118. In some embodiments, the tiling of the electronic devices 102E mayadapt a method of engaging the protrusion parts of the substrate 120with the light-emitting elements 16 and a method of adhering theelectronic devices 102E to the substrate 120 through the adhesive layer118. The adhesive layer 118 may be disposed between at least one of theprotrusion parts of the substrate 120 and the first circuit layers 14.For example, the electronic devices 100E at the center of the tilingelectronic apparatus 100E may adapt the engaging method, and theelectronic devices 100E at the peripheral of the tiling electronicapparatus 100E may adapt the adhering method in case that the electronicdevice 102E is loosed off. It is noted that the adhesive layer 118 maynot fill up the gaps between the light-emitting elements 16, and voidsmay be generated between the adhesive layer 118 and the first circuitlayers 14, such that the light from the light-emitting element 16 may bediffused through the voids, thereby widening the emitting angle andincreasing the viewing angle of the tiling electronic apparatus 100E. Insome embodiment, the electronic device 102E may also adapt theelectronic device of any one above-mentioned embodiment.

As mentioned above, in the tiling electronic apparatus of the presentdisclosure, since the electronic devices are independently engaged withthe protrusion parts of the first substrate, single one electronicdevice may be taken apart from the protrusion parts alone, therebyfacilitating repair or exchange for the single one electronic device.Furthermore, in the electronic device of the present disclosure, atleast one of the second circuit layer, the second surface of the basesubstrate and the surface of the first circuit layer facing thelight-emitting elements comprises at least one microstructure, such thatthe electronic device may have better flexibility when the electronicdevice is bent and may not be damaged due to bending.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the disclosure. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. An electronic device, comprising: a basesubstrate, having a plurality of through holes; a first circuit layer,disposed on the base substrate; and a plurality of light-emittingelements, disposed on the first circuit layer; wherein an absolute valueof a difference between two adjacent spacings of the plurality ofthrough holes of the base substrate is less than 0.5 times radius ofcurvature of the electronic device when the electronic device is bent.2. The electronic device as claimed in claim 1, wherein the firstcircuit layer comprises: a first portion, disposed on a first surface ofthe base substrate; a second portion, disposed on a second surface ofthe base substrate opposite to the first surface; and a third portion,connecting the first portion and the second portion, wherein theplurality of light-emitting elements are disposed on the first portion,and the third portion overlaps a side surface of the base substratealong a direction perpendicular to a top view direction of theelectronic device.
 3. The electronic device as claimed in claim 2,further comprising an insulating layer disposed between adjacent two ofthe plurality of light-emitting elements, wherein the insulating layeroverlaps at least one of the plurality of through holes.
 4. Theelectronic device as claimed in claim 2, further comprising aninsulating layer disposed between adjacent two of the plurality oflight-emitting elements, wherein the insulating layer overlaps thesecond portion of the first circuit layer.
 5. The electronic device asclaimed in claim 1, further comprising an insulating layer disposedbetween adjacent two of the plurality of light-emitting elements.
 6. Theelectronic device as claimed in claim 5, wherein the insulating layeroverlaps at least one of the plurality of through holes.